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AMD
XCZU3EG-2SFVC784I ImageView larger image
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XCZU3EG-2SFVC784I

Stock Available Reference Price(In US Dollars)
1+
$697.94
Manufacturer Part Number:
XCZU3EG-2SFVC784I
Manufacturer / Brand
AMD
Part of Description:
IC SOC CORTEX-A53 784FCBGA
Datasheets:
XCZU3EG-2SFVC784I.pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XCZU3EG-2SFVC784I
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 784FCBGA
Lead Free Status / RoHS Status: ROHS3 Compliant
Supplier Device Package 784-FCBGA (23x23)
Speed 533MHz, 600MHz, 1.3GHz
Series Zynq® UltraScale+™ MPSoC EG
RAM Size 256KB
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Peripherals DMA, WDT
Package / Case 784-BFBGA, FCBGA
Package Tray
Operating Temperature -40°C ~ 100°C (TJ)
Number of I/O 252
Flash Size -
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Base Product Number XCZU3
Architecture MCU, FPGA

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XCZU3EG-2SFVC784I Product Details:

Title: Unpacking the XCZU3EG-2SFVC784I: An Innovative System On Chip Solution for the Electronics Industry If you're looking for a powerful and innovative integrated circuit solution, the XCZU3EG-2SFVC784I is a top contender. This embedded system on chip (SoC) belongs to the Integrated Circuits (ICs) product classification and is designed to deliver efficiency, accuracy, and high-performance results across a wide range of electronic devices. With outstanding features like a maximum output voltage of 5V, output current of 6A, and an overall power capacity of 35W, the XCZU3EG-2SFVC784I is an excellent choice for high-power devices. It also boasts an exceptional temperature range of -40°C to +100°C, making it suitable for various industry-specific applications. But its applications go far beyond that - the XCZU3EG-2SFVC784I is versatile, fits perfectly in numerous electronic devices like medical equipment, industrial automation, and aerospace. Integrated circuits come in several types, such as digital, analog, mixed signal, and RF. The XCZU3EG-2SFVC784I is a mixed-signal type that can integrate and support multiple functions in one silicon chip. This SoC is designed with several analog and digital signal-processing blocks to guarantee stable and accurate signal conversion. The XCZU3EG-2SFVC784I has a complex manufacturing process. It goes through chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and other procedures. Upon manufacturing completion, every finished product undergoes stringent testing to ensure component quality and performance. Conclusion Choose the XCZU3EG-2SFVC784I SoC for your project today and enjoy top-notch features, uncompromising quality, and the most sought-after performance for your high-power electronic devices. This article aims to provide insights into the essential features, applications, and manufacturing process of this innovative SoC solution.

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