Packaging
We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.
Global Shipment by DHL/FedEx/TNT/UPS
Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
| Shipment charges： |
(Reference DHL and FedEX) |
| Weight(KG): 0.00kg-1.00kg |
Price(USD$) : USD$60.00 |
| Weight(KG): 1.00kg-2.00kg |
Price(USD$) : USD$80.00 |
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.
- Other Shipment Way: SF Express for Asia; Chang-woo special air line for Korea, Aramexfor Middle East countries. Others more shipping way, please contact us.
We also can send the goods to your forwarder or your othersupplier, so that you can send the goods together. It may will save shipmentcharges for you, or may will more convenient for you.
- Shipping Details: Shippinginformation, We need shipping information including Receiver Company Name(Or personal), Receiver Name, Contact Number, Address and Zip Code. Please make sure these information to us, so that we can arrange the shipment faster.
- Delivery time: Deliverytime will need 2-5days to most of country all over the world for DHL/UPS/FEDEX/TNT.
XCVU080-3FFVC1517E Product Details:
Title: XCVU080-3FFVC1517E, Embedded-FPGA for High-Performance Computing Applications
The XCVU080-3FFVC1517E is a versatile and high-performance Field Programmable Gate Array (FPGA) with a model number of IC FPGA 832 I/O 2104FCBGA. It features a powerful built-in processing system, advanced hardware accelerators, and high-speed interfaces making it suitable for a wide range of high-performance computing applications.
This FPGA is classified as an Embedded-FPGA, which means it is a fully programmable logic device that can be customized to meet the design specifications of a broad range of systems and subsystems. It is designed to meet the requirements of high-performance computing applications, including machine learning, data analytics, and image processing.
The XCVU080-3FFVC1517E FPGA is equipped with a wide range of features including a high-performance 28nm Xilinx FPGA, over 800 digital signal processing engines, and an impressive 832 input/output pins. This FPGA offers an output voltage of up to 1.2V, with a current of up to 50A, and a power consumption of up to 190W. With a temperature range from -40 ℃ to 100 ℃, this FPGA is ideal for both commercial and industrial applications.
The XCVU080-3FFVC1517E FPGA has diverse application scenarios, and it is best suited for industries such as aerospace, defense, telecommunications, and automotive. It can also be used for specific applications such as high-performance computing, data center acceleration, and video processing.
Integrated circuits derive in different types including digital, analog, mixed-signal, and RF. The XCVU080-3FFVC1517E is a digital integrated circuit that provides digital functionality for applications.
The manufacturing process of the XCVU080-3FFVC1517E FPGA involves a complex and sophisticated process, including chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. After the manufacturing process, the finished product undergoes appropriate testing to ensure component quality.
In conclusion, the XCVU080-3FFVC1517E FPGA is a powerful and versatile Embedded-FPGA that offers superior hardware accelerators, high-speed interfaces, and a range of other features ideal for high-performance computing applications. With its unique features and diverse applications, it is an essential component in modern industrial designs.
