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AMD
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XCV600-6FG676C

Manufacturer Part Number:
XCV600-6FG676C
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 444 I/O 676FCBGA
Datasheets:
XCV600-6FG676C(1).pdfXCV600-6FG676C(2).pdfXCV600-6FG676C(3).pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XCV600-6FG676C
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 444 I/O 676FCBGA
Lead Free Status / RoHS Status: RoHS non-compliant
Voltage - Supply 2.375V ~ 2.625V
Total RAM Bits 98304
Supplier Device Package 676-FBGA (27x27)
Series Virtex®
Package / Case 676-BGA
Package Tray
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 15552
Number of LABs/CLBs 3456
Number of I/O 444
Number of Gates 661111
Mounting Type Surface Mount
Base Product Number XCV600

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XCV600-6FG676C Product Details:

XCV600-6FG676C: A Comprehensive Guide to the Integrated Circuit Technology The XCV600-6FG676C is a high-performance integrated circuit that belongs to the category of embedded field programmable gate arrays (FPGAs). Equipped with 444 input/output (I/O) ports and a 676FCBGA packaging, this integrated circuit is perfect for numerous industrial applications, such as automotive, aerospace, and consumer electronics. From a technical perspective, the XCV600-6FG676C features an output voltage of 1.2V, a current of 1A, and an average power consumption of 10 Watts. With an operational temperature range of -40°C to 100°C and overall accuracy of the system, this electronic component provides excellent reliability and performance in extreme conditions. Focusing on the different types of integrated circuits, the XCV600-6FG676C is a mixed-signal integrated circuit that combines both digital and analog signals in a single platform. This offers flexibility and adaptability to numerous applications while providing a seamless transition between digital and analog systems. As a Radio Frequency (RF) integrated circuit, the XCV600-6FG676C can operate at high-frequency ranges, making it ideal for wireless communication systems. The manufacturing process of the XCV600-6FG676C is highly complex, where chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. This ensures that the final product is of the highest quality, performance, and durability. In terms of application scenarios and usage, the XCV600-6FG676C can be used for a wide range of electronic devices, such as sensors, communication modules, and control systems. It is widely used in the aerospace industry for manufacturing satellites, in the automotive industry for engine control systems, and in the telecommunications industry for advanced network equipment. Finally, it is important to mention that finished products need to undergo appropriate packaging and testing to ensure component quality. Overall, the XCV600-6FG676C is an essential integrated circuit for modern-day electronics, and its application scenarios are only expected to grow in the future. With its advanced technology and expert performance, the XCV600-6FG676C is an ideal choice for various industrial applications.

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