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AMD
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XCV600-5FG676I

Manufacturer Part Number:
XCV600-5FG676I
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 444 I/O 676FCBGA
Datasheets:
XCV600-5FG676I(1).pdfXCV600-5FG676I(2).pdfXCV600-5FG676I(3).pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XCV600-5FG676I
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 444 I/O 676FCBGA
Lead Free Status / RoHS Status: RoHS non-compliant
Voltage - Supply 2.375V ~ 2.625V
Total RAM Bits 98304
Supplier Device Package 676-FBGA (27x27)
Series Virtex®
Package / Case 676-BGA
Package Tray
Operating Temperature -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells 15552
Number of LABs/CLBs 3456
Number of I/O 444
Number of Gates 661111
Mounting Type Surface Mount
Base Product Number XCV600

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XCV600-5FG676I Product Details:

Title: A Comprehensive Guide to XCV600-5FG676I: The Ultimate FPGA Solution for Embedded Systems In this article, we will explore XCV600-5FG676I, one of the most advanced Integrated Circuits (ICs) currently available in the market. This Field Programmable Gate Array or FPGA is specially designed for embedded applications requiring high-performance computing, flexibility, and reliability. Keep reading to find out how XCV600-5FG676I can revolutionize your electronic designs and improve your industry and business operations. Product Features and Performance Parameters At the core of XCV600-5FG676I lies its impressive output voltage, current, power, accuracy, efficiency, and temperature range. With its 444 I/O count, this IC FPGA is capable of exceptional performance, even under extreme conditions. XCV600-5FG676I is engineered to provide reliable and stable operation, making it suitable for a wide range of applications. Additionally, its compatibility with numerous programming tools and software, makes it highly convenient and versatile. Product Classification, Application Scenarios, and Usage Parameters XCV600-5FG676I belongs to the class of embedded - FPGAs, which can be utilized to design and implement complex systems. It is used in numerous electronic devices, including smartphones, networking equipment, automotive systems, industrial automation, and more. XCV600-5FG676I can be used in both commercial and industrial applications, such as communication systems, healthcare, and aerospace. Moreover, it is suitable for specific applications, including telecommunication base stations, data centers, control systems, and embedded systems. Types of Integrated Circuits ICs are categorized into different types, depending on their functionalities. XCV600-5FG676I is a digital IC, which means it processes digital signals. Other types of ICs include analog, mixed-signal, and RF. Analog ICs work with continuous electrical signals, mixed-signal ICs manage both digital and analog signals, and RF ICs process radiofrequency signals. Manufacturing Process The manufacturing process of XCV600-5FG676I is incredibly complex and involves several steps. From chip design to cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more, manufacturers need to ensure that each step is carried out with precision and expertise. Any failure in the manufacturing process can affect the performance and reliability of the end product. Packaging and Testing After the manufacturing process is complete, finished ICs need to undergo appropriate packaging and testing. This is done to ensure that each component is of high quality and meets the required specifications. Packaging helps to protect the IC from environmental factors, such as moisture, dust, and temperature. Testing, on the other hand, is essential to verify if the IC meets the required quality standards and performance parameters. Conclusion In conclusion, XCV600-5FG676I is a versatile and robust FPGA, suitable for various applications. Its exceptional features and performance parameters, combined with the complex manufacturing process, makes it a high-quality and reliable IC. Whether you are designing highly complex electronic systems or operating an industrial plant, XCV600-5FG676I can transform your operations and enhance your business efficiency. Get in touch with us today to learn more.

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