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AMD
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XCV100-4BG256C

Manufacturer Part Number:
XCV100-4BG256C
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 180 I/O 256BGA
Datasheets:
XCV100-4BG256C(1).pdfXCV100-4BG256C(2).pdfXCV100-4BG256C(3).pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

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Part Number XCV100-4BG256C
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 180 I/O 256BGA
Lead Free Status / RoHS Status: RoHS non-compliant
Voltage - Supply 2.375V ~ 2.625V
Total RAM Bits 40960
Supplier Device Package 256-PBGA (27x27)
Series Virtex®
Package / Case 256-BBGA
Package Tray
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 2700
Number of LABs/CLBs 600
Number of I/O 180
Number of Gates 108904
Mounting Type Surface Mount
Base Product Number XCV100

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XCV100-4BG256C Product Details:

Title: XCV100-4BG256C: The Ultimate Solution for High-End Applications XCV100-4BG256C is a cutting-edge product from the world of Integrated Circuits (ICs), specifically designed for Embedded - FPGAs (Field Programmable Gate Array). This product is ideal for high-end applications, and the article discusses its main features, performance parameters, application scenarios, usage, types of integrated circuits, complex manufacturing process, and its finished product testing. The XCV100-4BG256C is a high-end product with immense capabilities. With 256Ball Grid Array Package, it provides high-speed and high-performance connectivity. Its features include output voltage of 1.2V, output current of 100mA, operating temperature of -40°C to +100°C, and power consumption of only 25 mA at 3.3V. This product stands out in high-end applications such as medical devices, aviation, IoT, and edge computing. This product has broad application scenarios, and it can be used in various areas such as educational purposes, multimedia processing, digital signal processing, and networking. It is perfect for industries such as automotive, telecommunications, and industrial automation. There are different types of integrated circuits that you can use for distinct applications. Digital ICs are used to process digital signals. Analog ICs can process analogue signals. RF ICs process RF signals, while Mixed Signal ICs process both digital and analogue signals. The manufacturing process of XCV100-4BG256C is an intricate procedure that involves chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and many more. All these procedures come together to create a reliable and stable product with minimal interference. It is of utmost importance to test and package finished products accurately to ensure component quality. Finished products undergo testing to discover any defects, and appropriate packaging is implemented to prevent damage during transportation. In conclusion, XCV100-4BG256C is a truly incredible product that is suitable for high-end applications. Its reliable performance, advanced features, and broad application scenarios make it the perfect solution for anyone looking to invest in quality and reliable integrated circuits.

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