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AMD
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XC6SLX75T-N3FGG676I

Manufacturer Part Number:
XC6SLX75T-N3FGG676I
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 348 I/O 676FBGA
Datasheets:
XC6SLX75T-N3FGG676I(1).pdfXC6SLX75T-N3FGG676I(2).pdfXC6SLX75T-N3FGG676I(3).pdf
Lead Free Status / RoHS Status:
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC6SLX75T-N3FGG676I
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 348 I/O 676FBGA
Lead Free Status / RoHS Status: RoHS Compliant
Voltage - Supply 1.14V ~ 1.26V
Total RAM Bits 3170304
Supplier Device Package 676-FBGA (27x27)
Series Spartan®-6 LXT
Package / Case 676-BGA
Package Tray
Operating Temperature -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells 74637
Number of LABs/CLBs 5831
Number of I/O 348
Mounting Type Surface Mount
Base Product Number XC6SLX75

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC6SLX75T-N3FGG676I Product Details:

How XC6SLX75T-N3FGG676I Integrated Circuits (ICs) Can Revolutionize Your Electronic Devices If you've been searching for high-performance Integrated Circuits (ICs) that can provide greater flexibility and functionality for your electronic devices, then you should check out XC6SLX75T-N3FGG676I. This Embedded - FPGAs (Field Programmable Gate Array) is designed to meet the needs of various applications and industries, making it a versatile and reliable tool for your electronics projects. At its core, XC6SLX75T-N3FGG676I is a powerful IC that comes with a range of features that enable it to deliver top-notch performance. With an output voltage of 1.2V, current of 10mA, and maximum power usage of 2.2W, this IC ensures that your electronic circuits operate smoothly and without any glitches. The XC6SLX75T-N3FGG676I also boasts high accuracy, efficiency, and a temperature range of -40°C to 100°C, making it ideal for a wide range of applications. One of the key advantages of XC6SLX75T-N3FGG676I is its versatility. It can be used in various scenarios and industries such as aerospace, automotive, healthcare, industrial automation, and more. This IC is also widely used in applications such as artificial intelligence, machine vision, and data center acceleration, among others. As an FPGA, XC6SLX75T-N3FGG676I is ideal for designing complex digital circuits. FPGA technology allows for the direct programming of circuit functions, which provides unprecedented flexibility in achieving the desired circuit behavior. This flexibility has made FPGA technology popular across a wide range of applications and industries. XC6SLX75T-N3FGG676I is an example of a mixed-signal integrated circuit, meaning it includes both digital and analog components. This enables it to interface with real-world signals, making it perfect for sensor applications and other similar uses. Additionally, RF integrated circuits are increasingly being used in wireless communications systems, with XC6SLX75T-N3FGG676I being no exception. The RF capabilities of this IC make it an excellent choice for wireless system designs. The manufacturing process for XC6SLX75T-N3FGG676I is complex and requires several intricate steps such as chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. These steps ensure that the final product is of the highest quality, so you can trust XC6SLX75T-N3FGG676I for your electronics projects. Before leaving the factory, XC6SLX75T-N3FGG676I undergoes rigorous packaging and testing to ensure that the ICs meet the standards for component quality. This step is crucial to avoid damage to your electronic devices, ensuring reliable performance. Overall, XC6SLX75T-N3FGG676I is an essential integrated circuit that electronics enthusiasts should consider. This article has revealed that XC6SLX75T-N3FGG676I is versatile, powerful, and reliable in various applications with features that make it a perfect fit for your electronics projects.

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