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AMD
XC6SLX25-3CSG324C ImageView larger image
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XC6SLX25-3CSG324C

Stock Available Reference Price(In US Dollars)
126+
$68.25
Manufacturer Part Number:
XC6SLX25-3CSG324C
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 226 I/O 324CSBGA
Datasheets:
XC6SLX25-3CSG324C.pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC6SLX25-3CSG324C
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 226 I/O 324CSBGA
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Supply 1.14V ~ 1.26V
Total RAM Bits 958464
Supplier Device Package 324-CSPBGA (15x15)
Series Spartan®-6 LX
Package / Case 324-LFBGA, CSPBGA
Package Tray
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 24051
Number of LABs/CLBs 1879
Number of I/O 226
Mounting Type Surface Mount
Base Product Number XC6SLX25

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC6SLX25-3CSG324C Product Details:

Title: "XC6SLX25-3CSG324C: An Overview of Features, Application Scenarios, and Manufacturing Process of Embedded - FPGAs" As a popular Integrated Circuits (ICs) product, the XC6SLX25-3CSG324C is a high-performance device designed for embedded systems. This Field Programmable Gate Array (FPGA) features 226 I/Os in a 324CSBGA package, making it ideal for use in various embedded applications. One of the main features of the XC6SLX25-3CSG324C is its output voltage, current, power, accuracy, and efficiency parameters. With an operating voltage range of 1.14V to 1.26V, this IC can deliver up to 178,000 logic cells, 368Kbits of block RAM, and 360 GMACs of DSP throughput. This makes it a top choice for high-speed processing applications that require low power consumption. Moreover, the XC6SLX25-3CSG324C is versatile and can be used in many application scenarios. It is ideal for electronic devices such as home appliances, mobile devices, computer peripherals, and communication devices. It is also recommended for use in automotive and industrial control systems, medical and security equipment, and other specialized fields. As an FPGA, the XC6SLX25-3CSG324C is highly customizable, which makes it an excellent choice for applications that require rapid prototyping. In terms of manufacturing, the XC6SLX25-3CSG324C undergoes a complex process that involves chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. This IC has a high level of integration, which requires an advanced manufacturing process to ensure the highest quality and reliability. Additionally, the XC6SLX25-3CSG324C must undergo appropriate packaging and testing to guarantee component quality and performance. Finally, it is worth noting that integrated circuits come in various types, such as digital, analog, mixed signal, and RF. As for the XC6SLX25-3CSG324C, it is a digital FPGA that allows for user-defined functionality that can adapt to various application scenarios. In conclusion, the XC6SLX25-3CSG324C is an incredible integrated circuit with exceptional performance, versatility, and customization options. The XC6SLX25-3CSG324C stands out among other ICs because of its features, application scenarios, and complex manufacturing process. Its digital nature and FPGA design allow it to be highly adaptable, making it an ideal choice for developers and manufacturers in need of high-performance and customizable integrated circuits.

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