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AMD
XC3S700A-5FGG484C ImageView larger image
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XC3S700A-5FGG484C

Stock Available Reference Price(In US Dollars)
60+
$113.32
Manufacturer Part Number:
XC3S700A-5FGG484C
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 372 I/O 484FBGA
Datasheets:
XC3S700A-5FGG484C.pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC3S700A-5FGG484C
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 372 I/O 484FBGA
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Supply 1.14V ~ 1.26V
Total RAM Bits 368640
Supplier Device Package 484-FBGA (23x23)
Series Spartan®-3A
Package / Case 484-BBGA
Package Tray
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 13248
Number of LABs/CLBs 1472
Number of I/O 372
Number of Gates 700000
Mounting Type Surface Mount
Base Product Number XC3S700

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC3S700A-5FGG484C Product Details:

Title: XC3S700A-5FGG484C Integrated Circuit (IC): Main Features, Application Scenarios and Usage XC3S700A-5FGG484C is an embedded field-programmable gate array (FPGA) designed to cater to the needs of various electronic devices and industries. This IC model is known for its exceptional performance and reliability, making it an ideal choice for a wide range of applications. In this article, we will discuss the main features, performance parameters, application scenarios, and usage of the XC3S700A-5FGG484C. Main Features and Performance Parameters: The XC3S700A-5FGG484C comes with a broad range of main features and performance parameters that make it stand out in the market. Some of the essential features include its capability of handling up to 372 input/output (I/O) pins, offering a maximum operating temperature range of -40°C to +100°C, and providing an impressive output voltage and current. Additionally, it has a highly precise accuracy and efficiency rate, making it a reliable choice for demanding missions. Application Scenarios and Usage: The XC3S700A-5FGG484C is primarily used in advanced electronic devices and industries, such as aerospace and defense, automotive, telecommunication, medical, and consumer electronics. This IC model can also be used for various applications, including data processing, signal processing, image, and video processing. Different Types of Integrated Circuits: There are various types of integrated circuits, including digital, analog, mixed-signal, and RF, that are widely used in the market. The XC3S700A-5FGG484C is classified as an embedded-field programmable gate array (FPGA) and is designed to cater to specific application requirements. Manufacturing Process: The production of integrated circuits is a complex process that involves cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. These processes enable the creation of a highly reliable and accurate integrated circuit. Additionally, the finished products undergo packaging and testing to ensure superior component quality. Conclusion: The XC3S700A-5FGG484C is an exceptional integrated circuit that comes with an impressive range of features and performance parameters. Its ability to cater to various electronic devices and industries makes it a popular choice in the market. By highlighting the application scenarios, incorporating popular keywords, and emphasizing its features and benefits, this article will undoubtedly help increase the exposure and search engine ranking of the XC3S700A-5FGG484C integrated circuit.

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