Choose your country or region.

EnglishFrançaispolskiSlovenija한국의DeutschSvenskaSlovenskáMagyarországItaliaहिंदीрусскийTiếng ViệtSuomiespañolKongeriketPortuguêsภาษาไทยБългарски езикromânescČeštinaGaeilgeעִבְרִיתالعربيةPilipinoDanskMelayuIndonesiaHrvatskaفارسیNederland繁体中文Türk diliΕλλάδαRepublika e ShqipërisëአማርኛAzərbaycanEesti VabariikEuskeraБеларусьíslenskaBosnaAfrikaansIsiXhosaisiZuluCambodiaსაქართველოҚазақшаAyitiHausaКыргыз тилиGalegoCatalàCorsaKurdîLatviešuພາສາລາວlietuviųLëtzebuergeschmalaɡasʲМакедонскиMaoriМонголулсবাংলা ভাষারမြန်မာनेपालीپښتوChicheŵaCрпскиSesothoසිංහලKiswahiliТоҷикӣاردوУкраїна
AMD
XC2V40-5FGG256C ImageView larger image
Image may be representation.
See specs for product details.

XC2V40-5FGG256C

Manufacturer Part Number:
XC2V40-5FGG256C
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 88 I/O 256FBGA
Datasheets:
XC2V40-5FGG256C(1).pdfXC2V40-5FGG256C(2).pdfXC2V40-5FGG256C(3).pdf
Lead Free Status / RoHS Status:
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: info@ic-xilinx.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number XC2V40-5FGG256C
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 88 I/O 256FBGA
Lead Free Status / RoHS Status: RoHS Compliant
Voltage - Supply 1.425V ~ 1.575V
Total RAM Bits 73728
Supplier Device Package 256-FBGA (17x17)
Series Virtex®-II
Package / Case 256-BGA
Package Tray
Operating Temperature 0°C ~ 85°C (TJ)
Number of LABs/CLBs 64
Number of I/O 88
Number of Gates 40000
Mounting Type Surface Mount
Base Product Number XC2V40

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC2V40-5FGG256C Product Details:

Introducing the XC2V40-5FGG256C: A Next-Generation FPGA for Versatile Applications As technology continues to evolve, integrated circuits have become an indispensable component in many electronic devices. Among these circuits, FPGAs (Field Programmable Gate Arrays) are increasingly popular due to their programmable nature and flexibility. The XC2V40-5FGG256C from Xilinx is a cutting-edge FPGA that promises high performance, reliability, and versatility. In this article, we will delve deeper into the main features, performance parameters, manufacturing process, application scenarios and usage of the XC2V40-5FGG256C. Main Features and Performance Parameters The XC2V40-5FGG256C is a member of the Xilinx Virtex-II Pro series. The model number indicates that it has 40,000 logic cells, runs at a clock frequency of 5 MHz, and has a FBGA-256 package with 88 I/O pins. Some of the main features of this FPGA include configurable logic blocks, digital clock managers, DSP (Digital Signal Processing) blocks, embedded multipliers, and IOBs (Input/Output Blocks). The FPGA is also equipped with advanced interface protocols, such as PCI (Peripheral Component Interconnect), Ethernet, and USB (Universal Serial Bus). With an operating voltage range of 1.2V to 1.5V, the XC2V40-5FGG256C is capable of delivering up to 73,728 logic gates. Application Scenarios and Usage The XC2V40-5FGG256C is a highly versatile FPGA that can be used in a wide range of applications. It is particularly suitable for industries such as aerospace, defense, automotive, medical, and telecommunications. The FPGA's programmable nature makes it ideal for applications that require high-speed data processing, real-time signal processing, and low power consumption. Specific applications include radar systems, image processing, communication networks, motor control, gaming, and more. Due to its flexibility and scalability, the XC2V40-5FGG256C can be configured to meet the specific needs of various applications. Types of Integrated Circuits Integrated circuits are classified into several types, including digital, analog, mixed signal, and RF (Radio Frequency). While the XC2V40-5FGG256C is a digital circuit, it can interface with other circuits of different types to achieve the desired functionality. Digital circuits use binary signals to represent information, while analog circuits use continuous signals. Mixed-signal circuits combine both digital and analog circuits to perform complex functions. RF circuits are used in wireless communication systems to transmit and receive signals. Manufacturing Process The manufacturing process of integrated circuits is a complex and highly specialized process. It includes several steps, such as chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. The entire process is carried out in a cleanroom environment to prevent contamination. Each step requires precise control and testing to ensure the quality and reliability of the finished product. Packaging and Testing After the manufacturing process, the finished product needs to undergo appropriate packaging and testing to ensure component quality. The XC2V40-5FGG256C is packaged in a FBGA-256 package, which provides good thermal and electrical properties. The packaging also protects the chip from environmental factors and mechanical stress. Testing involves verifying the functionality, performance, and reliability of the FPGA. Different types of tests, such as functional, parametric, and reliability tests, are conducted to check the FPGA's compliance with specifications. Conclusion The XC2V40-5FGG256C is a powerful and versatile FPGA that promises high performance and flexibility. Its advanced features and capabilities make it suitable for a wide range of applications, from aerospace to gaming. With a comprehensive understanding of its main features, performance parameters, manufacturing process, and application scenarios, users can harness its full potential and achieve optimal results in their respective fields.

You May Also Be Interested In: