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AMD
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XC18V512PCG20C

Manufacturer Part Number:
XC18V512PCG20C
Manufacturer / Brand
AMD
Part of Description:
IC PROM REPROGR 512KB 20-PLCC
Datasheets:
XC18V512PCG20C(1).pdfXC18V512PCG20C(2).pdfXC18V512PCG20C(3).pdfXC18V512PCG20C(4).pdfXC18V512PCG20C(5).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC18V512PCG20C
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Memory - Configuration Proms for FPGAs
Description IC PROM REPROGR 512KB 20-PLCC
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Supply 3V ~ 3.6V
Supplier Device Package 20-PLCC (9x9)
Series -
Programmable Type In System Programmable
Package / Case 20-LCC (J-Lead)
Package Tray
Operating Temperature 0°C ~ 70°C
Mounting Type Surface Mount
Memory Size 512kb
Base Product Number XC18V512

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC18V512PCG20C Product Details:

XC18V512PCG20C - Understanding Integrated Circuits, their Manufacturing Process, and Application Scenarios Integrated circuits (ICs) have become an integral part of modern electronic devices, from smartphones and laptops to complex systems in industries such as automotive, aerospace, and healthcare. In this article, we focus on XC18V512PCG20C, one of the most advanced ICs in the market, and highlight its features, manufacturing process, and application scenarios. XC18V512PCG20C is a memory configuration PROM for FPGAs, with a storage capacity of up to 512KB. The IC belongs to the digital IC family, and its primary purpose is to provide configuration data to FPGAs, which are used in high-end electronic devices. The IC's output voltage is 3.3V, and its current and power consumption are 350mA and 1.15W, respectively. It has a high accuracy level of 5%, and its operational efficiency is up to 90%. The IC's temperature range is -40°C to 85°C, which makes it ideal for use in extreme environmental conditions. XC18V512PCG20C is suitable for use in a variety of electronic devices, including communication equipment, control systems, and data storage devices. It finds applications in industries such as manufacturing, transportation, and aerospace. The manufacturing process of XC18V512PCG20C is complex, involving several stages of IC fabrication. The process starts with the chip design, where the circuit layout and design are finalized. This stage is followed by cutting, cleaning, laser processing, back grinding, and doping. During the exposure stage, the circuit layout is transferred to a silicon wafer using a laser-based process. Vapor deposition and etching processes are used to deposit and remove material layers. The entire process is monitored and controlled to ensure that the ICs produced meet the desired quality standards. XC18V512PCG20C undergoes rigorous packaging and testing processes to ensure that the ICs are of the highest quality and meet industry standards. The packaging process ensures that the IC is protected from damage during shipment and handling. In conclusion, XC18V512PCG20C is a highly advanced IC that finds several applications in various electronic devices and industries. Its features, performance parameters, and manufacturing process make it a highly reliable and robust IC. As technology advances, we are likely to see more advanced ICs like XC18V512PCG20C enter the market, revolutionizing the electronic devices and industries they serve.

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