Packaging
We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.
Global Shipment by DHL/FedEx/TNT/UPS
Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
| Shipment charges： |
(Reference DHL and FedEX) |
| Weight(KG): 0.00kg-1.00kg |
Price(USD$) : USD$60.00 |
| Weight(KG): 1.00kg-2.00kg |
Price(USD$) : USD$80.00 |
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.
- Other Shipment Way: SF Express for Asia; Chang-woo special air line for Korea, Aramexfor Middle East countries. Others more shipping way, please contact us.
We also can send the goods to your forwarder or your othersupplier, so that you can send the goods together. It may will save shipmentcharges for you, or may will more convenient for you.
- Shipping Details: Shippinginformation, We need shipping information including Receiver Company Name(Or personal), Receiver Name, Contact Number, Address and Zip Code. Please make sure these information to us, so that we can arrange the shipment faster.
- Delivery time: Deliverytime will need 2-5days to most of country all over the world for DHL/UPS/FEDEX/TNT.
XC1736EVOG8C Product Details:
Title: XC1736EVOG8C: A Comprehensive Guide to Integrated Circuits (ICs) for FPGA Memory - Configuration Proms
Integrated Circuits (ICs) have become a vital component in electronic devices, modern industries, and specific applications. The XC1736EVOG8C is one such IC that is designed for FPGA Memory - Configuration Proms, boasting the necessary features to meet the demands of various electronic devices.
Main Features:
XC1736EVOG8C is a IC PROM SERIAL 36K 8-SOIC package configuration memory integrated circuit. It has a high-speed programming time and a low standby power dissipation. Moreover, this device has a memory organization of 4,608 words by 8 bits.
Product Classification:
This IC is classified as a Sierra IC product, with the part type being Configuration Proms for FPGAs. It is part of the XC17Axx, XC17Vxx, and XC18Vxx series.
Application Scenarios:
The XC1736EVOG8C is used to configure FPGA devices, which are often found in various applications like communications, industrial equipment, and automotive electronics. This IC is suitable for use in applications that require non-volatile memory storage.
Usage and Feature Parameters:
This IC can be configured and used to store data reliably, even when the power supply is removed. The XC1736EVOG8C has an output voltage of 5V, maximum current of 30mA, with an operating temperature range of -40°C to 85°C.
Types of Integrated Circuits (ICs):
There are different types of integrated circuits, including digital, analog, mixed-signal, and RF. Digital ICs perform logical operations, while analog ICs manipulate continuous electrical signals. On the other hand, mixed-signal ICs are capable of processing both digital and analog circuits. RF ICs are designed to operate at high frequencies.
Manufacturing Process:
Integrated circuits require a complex manufacturing process that involves chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. These processes are carried out in a clean-room environment to ensure the IC's reliability and consistency.
Packaging and Testing:
Finished IC products need to undergo appropriate packaging and testing to ensure the component quality. The XC1736EVOG8C is packaged in an 8-SOIC package, and testing includes functional and electrical testing.
Conclusion:
In conclusion, the XC1736EVOG8C integrated circuit is an important component for FPGA devices and is suitable for various electronic applications, including communications, industrial equipment, and automotive electronics. With its high-speed programming time and low power dissipation, it provides cost-effective solutions for non-volatile memory storage. By highlighting its main features, performance parameters, application scenarios, manufacturing process, and packaging/testing, this article provides a comprehensive guide to integrated circuits for FPGA memory- Configuration Proms.
