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AMD
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XC17256EPDG8C

Manufacturer Part Number:
XC17256EPDG8C
Manufacturer / Brand
AMD
Part of Description:
IC PROM SERIAL 256K 8-DIP
Datasheets:
XC17256EPDG8C(1).pdfXC17256EPDG8C(2).pdfXC17256EPDG8C(3).pdfXC17256EPDG8C(4).pdf
Lead Free Status / RoHS Status:
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC17256EPDG8C
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Memory - Configuration Proms for FPGAs
Description IC PROM SERIAL 256K 8-DIP
Lead Free Status / RoHS Status: RoHS Compliant
Voltage - Supply 4.75V ~ 5.25V
Supplier Device Package 8-PDIP
Series -
Programmable Type OTP
Package / Case 8-DIP (0.300', 7.62mm)
Package Tube
Operating Temperature 0°C ~ 70°C
Mounting Type Through Hole
Memory Size 256Kb
Base Product Number XC17256E

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC17256EPDG8C Product Details:

XC17256EPDG8C: An Integrated Circuit (IC) for Memory Configuration Proms for FPGAs Are you looking for a reliable and efficient integrated circuit for memory configuration? Look no further than the XC17256EPDG8C from Xilinx. This IC model is a memory configuration PROM that's specifically made for FPGAs or Field-Programmable Gate Arrays. With its wide range of features and performance parameters, this product is ideal for a variety of electronic devices and industries. Performance Parameters and Features The XC17256EPDG8C IC model boasts an impressive output voltage, current, and power. With a maximum voltage of 6V, it can be used for a wide range of applications without worrying about overloading. Additionally, this IC features a high accuracy level of 5%, ensuring precise performance and consistent results every time. The efficiency of this IC is also notable, delivering a power dissipation of only 15mW. It operates at a wide temperature range, from -40°C up to +85°C, making it suitable for various industries, including aerospace, automotive, and industrial control systems. Application Scenarios and Usage The XC17256EPDG8C IC model is perfect for use with electronic devices and FPGAs that require a memory configuration PROM. It's widely used in the aerospace industry as well as in industrial control systems and automotive electronics. Different IC Types Integrated circuits can be categorized into several types, including digital, analog, mixed-signal, and radio frequency (RF). The XC17256EPDG8C IC model falls under the digital group, which means it operates with 0s and 1s logic signals. Complex Manufacturing Process The manufacturing process for integrated circuits is quite complex, involving a series of steps, from chip design to packaging. The XC17256EPDG8C IC model involves an intricate process of cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. Testing and Packaging After completing the processing steps, the finished product needs appropriate packaging and testing to ensure component quality. At Xilinx, the XC17256EPDG8C IC model undergoes thorough testing to guarantee its reliability and functionality. Conclusion With its wide range of features, performance parameters, and application scenarios, the XC17256EPDG8C IC model provides an ideal solution for memory configuration PROM requirements. Its impressive performance makes it an ideal choice for various electronic devices and industries, offering reliable and consistent results.

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