Packaging
We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.
Global Shipment by DHL/FedEx/TNT/UPS
Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
| Shipment charges: |
(Reference DHL and FedEX) |
| Weight(KG): 0.00kg-1.00kg |
Price(USD$) : USD$60.00 |
| Weight(KG): 1.00kg-2.00kg |
Price(USD$) : USD$80.00 |
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.
- Other Shipment Way: SF Express for Asia; Chang-woo special air line for Korea, Aramexfor Middle East countries. Others more shipping way, please contact us.
We also can send the goods to your forwarder or your othersupplier, so that you can send the goods together. It may will save shipmentcharges for you, or may will more convenient for you.
- Shipping Details: Shippinginformation, We need shipping information including Receiver Company Name(Or personal), Receiver Name, Contact Number, Address and Zip Code. Please make sure these information to us, so that we can arrange the shipment faster.
- Delivery time: Deliverytime will need 2-5days to most of country all over the world for DHL/UPS/FEDEX/TNT.
XC17256EPDG8C Product Details:
XC17256EPDG8C: An Integrated Circuit (IC) for Memory Configuration Proms for FPGAs
Are you looking for a reliable and efficient integrated circuit for memory configuration? Look no further than the XC17256EPDG8C from Xilinx. This IC model is a memory configuration PROM that's specifically made for FPGAs or Field-Programmable Gate Arrays. With its wide range of features and performance parameters, this product is ideal for a variety of electronic devices and industries.
Performance Parameters and Features
The XC17256EPDG8C IC model boasts an impressive output voltage, current, and power. With a maximum voltage of 6V, it can be used for a wide range of applications without worrying about overloading. Additionally, this IC features a high accuracy level of 5%, ensuring precise performance and consistent results every time.
The efficiency of this IC is also notable, delivering a power dissipation of only 15mW. It operates at a wide temperature range, from -40°C up to +85°C, making it suitable for various industries, including aerospace, automotive, and industrial control systems.
Application Scenarios and Usage
The XC17256EPDG8C IC model is perfect for use with electronic devices and FPGAs that require a memory configuration PROM. It's widely used in the aerospace industry as well as in industrial control systems and automotive electronics.
Different IC Types
Integrated circuits can be categorized into several types, including digital, analog, mixed-signal, and radio frequency (RF). The XC17256EPDG8C IC model falls under the digital group, which means it operates with 0s and 1s logic signals.
Complex Manufacturing Process
The manufacturing process for integrated circuits is quite complex, involving a series of steps, from chip design to packaging. The XC17256EPDG8C IC model involves an intricate process of cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more.
Testing and Packaging
After completing the processing steps, the finished product needs appropriate packaging and testing to ensure component quality. At Xilinx, the XC17256EPDG8C IC model undergoes thorough testing to guarantee its reliability and functionality.
Conclusion
With its wide range of features, performance parameters, and application scenarios, the XC17256EPDG8C IC model provides an ideal solution for memory configuration PROM requirements. Its impressive performance makes it an ideal choice for various electronic devices and industries, offering reliable and consistent results.