Packaging
We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.
Global Shipment by DHL/FedEx/TNT/UPS
Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
| Shipment charges: |
(Reference DHL and FedEX) |
| Weight(KG): 0.00kg-1.00kg |
Price(USD$) : USD$60.00 |
| Weight(KG): 1.00kg-2.00kg |
Price(USD$) : USD$80.00 |
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.
- Other Shipment Way: SF Express for Asia; Chang-woo special air line for Korea, Aramexfor Middle East countries. Others more shipping way, please contact us.
We also can send the goods to your forwarder or your othersupplier, so that you can send the goods together. It may will save shipmentcharges for you, or may will more convenient for you.
- Shipping Details: Shippinginformation, We need shipping information including Receiver Company Name(Or personal), Receiver Name, Contact Number, Address and Zip Code. Please make sure these information to us, so that we can arrange the shipment faster.
- Delivery time: Deliverytime will need 2-5days to most of country all over the world for DHL/UPS/FEDEX/TNT.
EF-DI-USXGMII-MAC-SITE Product Details:
Title: EF-DI-USXGMII-MAC-SITE: High-Performance Development Boards with Cutting-Edge Features and Wide Application Scenarios
Are you looking for a high-quality development board that can meet your specific application needs? Meet the EF-DI-USXGMII-MAC-SITE – a powerful development board with advanced features that can cater to various industries' requirements.
EF-DI-USXGMII-MAC-SITE is a versatile development kit suitable for different electronic devices and industries. It uses the LOGICORE IP Ethernet Subsystems to provide a USXGMII interface with a speed of 10M/100M/1G/2.5G. The development board delivers excellent performance in various application scenarios, including networking, data centers, servers, and storage.
The EF-DI-USXGMII-MAC-SITE development board features a state-of-the-art design, high-precision, and reliable operational parameters. It offers an impressive output voltage of 1.0V, a current of 100mA, and can produce 2.5W of power. Additionally, the board's temperature range is -40 to 85°C, making it an ideal option for harsh environments.
This development board consists of multiple Integrated Circuits (ICs), mainly digital, mixed-signal, and RF circuits. The digital circuit is responsible for processing and managing data signals. The mixed-signal circuit integrates analog and digital circuits, allowing the board to perform both functions. Meanwhile, the RF circuit enables communication with remote devices via radio frequencies.
The EF-DI-USXGMII-MAC-SITE development board undergoes a complex manufacturing process to ensure excellent performance and reliability. Its production involves chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. The manufacturing process ensures that every development board is of high quality and meets specific operational standards.
Finished products must undergo appropriate testing and packaging. The testing process ensures that the component quality is up to the standard and that every development board performs optimally. The packaging process allows safe transportation of the boards and ensures that they reach the customers in excellent condition.
In conclusion, the EF-DI-USXGMII-MAC-SITE development board is an advanced and powerful development kit that can meet various industries' needs. With cutting-edge features, superior performance parameters, and wide application scenarios, it is an excellent option for anyone in search of a quality development board.