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Setšoantšo e kanna ea ba moemeli.
Bona linepe bakeng sa lintlha tsa sehlahisoa.

XCS30XL-5PQ208C

Moetsi Karolo ea Karolo:
XCS30XL-5PQ208C
Moqapi / Brand
AMD
Karolo ea Tlhaloso:
IC FPGA 169 I/O 208QFP
Datasheets:
XCS30XL-5PQ208C(1).pdfXCS30XL-5PQ208C(2).pdf
Temo ea mahala ea boemo bo phahameng / boemo ba RoHS:
RoHS e sa lumellaneng
Boemo ba setoko:
Ncha ea mantlha, E fumaneha.
Tsamaisa Ho Tloha:
Hong Kong
Tsela ea thomello:
DHL/Fedex/TNT/UPS

Tlhahlobo Inthaneteng

Ka kopo tlatsa likarolo tsohle tse hlokahalang ka tlhaiso-leseling ea hau ea puisano.Chofoza "TLHOKOMELANG TLALI"Re tla ikopanya le wena haufinyane ka lengolo-tsoibila. Kapa re romelle lengolo-tsoibila: info@ic-xilinx.com
Karolo ea Karolo
Moetsi
Hloka Boholo
Theko ea theko(USD)
Lebitso la K'hamphani
Lebitso la ho ikopanya
E-mail
Nomoro
Molaetsa
Ka kopo kenya Code ea netefatso ebe o tobetsa "Kenya"
Karolo ea Karolo XCS30XL-5PQ208C
Moqapi / Brand AMD
Sehlopha Litokisetso tse kopanetsoeng (IC) > E kenelletse - FPGAS (Lenaneo la Field Goandrable)
Tlhaloso IC FPGA 169 I/O 208QFP
Temo ea mahala ea boemo bo phahameng / boemo ba RoHS: RoHS e sa lumellaneng
Tšebeliso ea Voltage 3V ~ 3.6V
Kakaretso ea Bits ea RAM 18432
Package ea Lisebelisoa tsa Thepa 208-PQFP (28x28)
Sehlooho Spartan®-XL
Package / Case 208-BFQFP
Package Tray
Mocheso o sebetsang 0°C ~ 85°C (TJ)
Palo ea Lintho tse Bonngoeng / Lisele 1368
Palo ea LABs / CLBs 576
Palo ea I / O 169
Palo ea Matloana 30000
Mofuta oa ho Thaba Surface Mount
Nomoro ea sehlahisoa XCS30XL

Ho paka

Re fana ka boleng bo holimo ka ho fetisisa, ba pakiloeng ka theko e phahameng ka ho fetisisa ea moruo e fumanehang. Ka ponaletso ea leseli ea 40%, e iponahatsa e le pontšo ea li-IC's (li-circuits tse kopaneng) le li-PCB (li-boardcircuit board). Ts'ireletso ea tšepe e tšoarellang ho feta e patiloeng e fa FaradayCage ts'ebetso e hlokahalang ho sirelletsa likonteraka tsena khahlano le li-tuli.

Lihlahisoa tsohle li tla paka ka anti-tuli. Tsamaisa ka ts'ireletso ea antistatic ea ESD.
Ntle le tse fumanehang ka har'a lipakatso tsa ESD li tla sebelisa leseli la rona: Karolo ea Motsoako, Brand le Boholo.
Re tla hlahloba thepa eohle pele re tsamaisoa, re netefatsa hore lihlahisoa tsohle li maemong a matle mme re netefatse hore likarolo ke litheolelo tse ncha tsaalmalmatch.
Kamora hore thepa eohle e netefatse hore ha e na mathata ka mor'a ho paka, re tla e paka ka mokhoa o sireletsehileng mme ra romella ka polelo ea lefats'e. E bontša ho phunya le ho hanyetsa likhapha hammoho le botšepehi bo tiileng ba tiiso.
Re ka fana ka ts'ebeletso ea ho fana ka litšebeletso lefatšeng ka bophara, joalo ka DHLor FedEx kapa TNT kapa UPS kapa e mong ea fetisang thepa pele.

Tsamaiso ea Lefatše ka bophara ke DHL / FedEx / TNT / UPS

Litefiso tsa Shipping DHL / FedEx
1). O ka fana ka akhaonto ea hau ea tlhahiso ea thepa bakeng sa ho romelloa, haeba u se na ak'haonte efe kapa efe ea ho romella thepa, re ka fana ka tlaleho ea inadvance ea rona.
2). Sebelisa ak'haonte ea rona bakeng sa ho romella thepa, Tefo ea Thomello (Reference DHL / FedEx, linaha tse fapaneng li na le theko e fapaneng.)
Litefiso tsa thomello :: (Reference DHL le FedEX)
Boima (KG): 0.00kg-1.00kg Theko (USD $): USD $ 60.00
Boima (KG): 1.00kg-2.00kg Theko (USD $): USD $ 80.00
* Theko ea litšenyehelo e bontšoa ho DHL / FedEx. Lintlha tse qotsitsoeng, ka kopo ikopanye le rona. Naha e fapaneng liqoso tse hlahisitsoeng ke tse fapaneng.



XCS30XL-5PQ208C Lintlha tsa sehlahisoa:

XCS30XL-5PQ208C Integrated Circuit (IC) - A High-Performance Solution for Embedded Design The XCS30XL-5PQ208C is an excellent example of the latest and most advanced Field Programmable Gate Arrays (FPGAs) available in the market today. Its high-performance features, coupled with its exceptional versatility, make it the optimal choice for various embedded designs, allowing for a wide range of applications. At its core, this Integrated Circuit (IC) is classified as an FPGA, a programmable device that can be customized to match specific project requirements. The XCS30XL-5PQ208C combines a highly effective combination of performance, efficiency, and accuracy backed up by an FPGA with 169 I/O. The wide range of features and specifications make it a popular choice for numerous electronic devices and industries. Main Features and Performance Parameters One of the main features of the XCS30XL-5PQ208C Integrated Circuit is its output voltage, which can range from 1.2V to 3.3V, offering considerable flexibility in the design process. The current can reach up to 230mA, making it capable of handling high current loads with ease. Additionally, its power can reach up to 5V and has a high accuracy level. Efficiency is also an essential parameter in any design, and the XCS30XL-5PQ208C exhibits an impressive level of up to 75%, ideal for applications where energy consumption is critical. Also, the operating temperature range of this IC is between -40°C and 100°C, thus ensuring its reliability under different environmental conditions. Application Scenarios and Usage Uses for this IC vary due to its versatile design, making it ideal for numerous devices and industries. Some examples where XCS30XL-5PQ208C can be applied include the following: 1. Networking equipment, such as routers and access points 2. Industrial automation and control systems 3. Military and aerospace applications 4. Medical equipment 5. High-performance audio and video devices 6. Automotive applications Different Types of Integrated Circuits There are various types of Integrated Circuits, including digital, analog, mixed signal, and RF types. The XCS30XL-5PQ208C falls into the category of digital Integrated Circuits, which means it operates with discrete values or 'digits.' The digital nature of the IC provides increased performance compared to analog-based designs. Complex Manufacturing Process The manufacturing process for the XCS30XL-5PQ208C is multi-faceted and requires several steps. It starts with chip design and continues with cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and diffusion. Packaging and Testing to Ensure Component Quality Finally, the finished IC undergoes appropriate packaging and testing, which is a critical step in ensuring component quality and long-term reliability. During the packaging and testing process, manufacturers make sure the IC meets all the required specifications and criteria. Conclusion In conclusion, the XCS30XL-5PQ208C Integrated Circuit is an essential component in modern-day electronics. Its high-performance features, including output voltage, current, power, accuracy, efficiency, and temperature range, coupled with its versatility, make it an excellent fit for various applications. Different types of ICs are available for different purposes, and the XCS30XL-5PQ208C is classified as a digital IC. The manufacturing process for this IC is quite complex, but it ensures a high level of reliability. Finally, appropriate testing and packaging ensure the quality and longevity of the final product.

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