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AMD
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XCZU2EG-3SBVA484E

Framleiðandi Hlutanúmer:
XCZU2EG-3SBVA484E
Framleiðandi / Vörumerki
AMD
Hluti af Lýsing:
IC SOC CORTEX-A53 484FCBGA
Gagnablöð:
XCZU2EG-3SBVA484E.pdf
Leiða frjáls staða / RoHS staða:
Ástand á lager:
Nýtt frumlegt, lager í boði.
Skip frá:
Hong Kong
Sending vegur:
DHL/Fedex/TNT/UPS

Fyrirspurnir Online

Vinsamlegast fylltu út alla reitina sem þarf til að hafa samband við þig. Smelltu á „SENDA UM BÖRN„við munum hafa samband fljótlega með þér með tölvupósti. Eða sendu okkur tölvupóst: info@ic-xilinx.com
Hlutanúmer
Framleiðandi
Krefjast Magn
Markverð(USD)
nafn fyrirtækis
Nafn tengiliðar
Tölvupóstur
Sími
Skilaboð
Vinsamlegast sláðu inn Staðfestingarkóða og smelltu á "Senda"
Hlutanúmer XCZU2EG-3SBVA484E
Framleiðandi / Vörumerki AMD
Flokkur Innbyggð hringrás (ICs) > Embedded - System On Chip (SoC)
Lýsing IC SOC CORTEX-A53 484FCBGA
Leiða frjáls staða / RoHS staða: RoHS Compliant
Birgir Tæki Pakki 484-FCBGA (19x19)
Hraði 600MHz, 667MHz, 1.5GHz
Röð Zynq® UltraScale+™ MPSoC EG
RAM stærð 256KB
Helstu eiginleikar Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Yfirborðslegur DMA, WDT
Pakki / tilfelli 484-BFBGA, FCBGA
Pakki Tray
Vinnuhitastig 0°C ~ 100°C (TJ)
Fjöldi I / O 82
Flash stærð -
Core örgjörvi Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Tengingar CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Arkitektúr MCU, FPGA

Umbúðir

Við bjóðum upp á hæsta gæðaflokki, hagkvæmustu og stöðluðu skjaldarumbúðirnar sem völ er á. Með 40% ljósgagnsæi gerir það kleift að auðkenna IC (samþættar hringrásir) og PCB (prentaðar hringrásarborð). Mjög varanlegur grafinn málmhindrun veitir FaradayCage frammistöðu sem nauðsynleg er til að verja skilin á þessum hlutum gegn rafhleðslu.

Allar vörur verða pakkaðar í andstæðingur-staticbag. Skip með ESD antistatic vernd.
Utan umbúðamiðstöðvar ESD mun nota upplýsingar fyrirtækisins okkar: Hlutafjöldi, vörumerki og magn.
Við munum skoða allar vörur fyrir sendingu, tryggja allar vörur í góðu ástandi og sjá til þess að hlutirnir séu nýtt originalmatch gagnablað.
Eftir að allar vörur eru tryggja engin vandamál eftir pökkun, munum við pakka á öruggan hátt og senda með alþjóðlegum tjá. Það sýnir sexcellent stungu og tárþol ásamt góðu innsigli.
Við getum boðið hraðþjónustu fyrir heim allan, svo sem DHLor FedEx eða TNT eða UPS eða annan framsendingaraðila til sendingar.

Alheimsending frá DHL / FedEx / TNT / UPS

Tilvísun sendingargjalda DHL / FedEx
1). Þú getur boðið hraðsendingareikninginn þinn fyrir sendingu, ef þú ert ekki með neinn hraðsreikning fyrir sendingu, þá getum við boðið reikninginn þinn óviðeigandi.
2). Notaðu reikninginn okkar fyrir sendingu, sendingargjöld (Tilvísun DHL / FedEx, mismunandi lönd eru með mismunandi verð.)
Sendingargjöld : (Tilvísun DHL og FedEX)
Þyngd (KG): 0,00 kg-1,00 kg Verð (USD $): USD 60,00
Þyngd (KG): 1,00 kg-2,00 kg Verð (USD $): USD 80,00
* Verð á kostnaði er tilvísun með DHL / FedEx. Smáatriðin rukka, vinsamlegast hafðu samband. Mismunandi land og hleðslur eru mismunandi.



XCZU2EG-3SBVA484E Upplýsingar um vöru:

XCZU2EG-3SBVA484E: An Integrated Circuit with Top-of-the-Line Performance Parameters for Embedded Systems Are you looking for an integrated circuit with a high level of performance, accuracy, and efficiency? Look no further than the XCZU2EG-3SBVA484E! This SoC (system on chip) by Xilinx boasts many significant features that make it ideal for use in various electronic devices and industries. In this article, we will discuss the XCZU2EG-3SBVA484E's model number, main features, product classification, application scenarios, usage, and feature parameters to help you understand the technology behind it. Model Number and Main Features: XCZU2EG-3SBVA484E The XCZU2EG-3SBVA484E is an integrated circuit that combines CPU, GPU, DSP, and FPGA modules to achieve a high level of performance. This SoC also boasts the following main features: - A dual-core ARM Cortex-A53 processor that can operate at a maximum speed of 1.5 GHz - A quad-core ARM Cortex-R5 real-time processor that can operate at a maximum speed of 600 MHz - 256 KB of L2 cache and 4 MB of L3 cache - 4 GB of DDR4 memory with a clock speed of 2.4 GHz - A Mali-400 GPU with support for OpenGL ES 2.0 and OpenVG 1.1 - A 16 nm FinFET+ manufacturing process for reduced power consumption and increased performance Product Classification and Application Scenarios The XCZU2EG-3SBVA484E belongs to the embedded-systems-on-chip (SoC) category of integrated circuits. Its high-performance features make it suitable for various applications, such as automotive, aerospace, industrial, medical, and IoT devices. The XCZU2EG-3SBVA484E is also useful for applications that require real-time data processing, such as video and image processing, machine learning, and computer vision. Usage and Feature Parameters The XCZU2EG-3SBVA484E is a versatile integrated circuit that can be used in various electronic devices, including: - Medical and healthcare systems - Industrial automation and control - Aerospace and defense systems - Automotive infotainment and driver assistance systems - IoT gateways and edge nodes Some of the feature parameters that make the XCZU2EG-3SBVA484E stand out include: - Output voltage: 0.85 V to 1.15 V - Output current: up to 20 A - Power: up to 35 W - Accuracy: ±1% - Efficiency: up to 91% - Temperature range: -40°C to 100°C Types of Integrated Circuits There are different types of integrated circuits, including digital, analog, mixed-signal, and RF integrated circuits. The XCZU2EG-3SBVA484E is a digital SoC that combines various digital components to form a complete system on a single chip. Digital circuits process binary data, whereas analog circuits process continuous signals. Mixed-signal circuits, on the other hand, combine digital and analog circuits, while RF circuits process radio-frequency signals. Complex Manufacturing Process The manufacturing process of the XCZU2EG-3SBVA484E is complex and involves various steps, such as chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. The 16 nm FinFET+ manufacturing process used to manufacture the XCZU2EG-3SBVA484E is known for its high level of precision, power efficacy, and performance. Packaging and Testing After the manufacturing process, the XCZU2EG-3SBVA484E undergoes appropriate packaging and testing to ensure the component quality. Testing is critical to ensure that the integrated circuit meets the performance and reliability requirements of its intended application. Conclusion The XCZU2EG-3SBVA484E is an integrated circuit that combines various components to form a complete system on a single chip. It boasts a high level of performance, accuracy, and efficiency, making it ideal for various electronic devices and industries. This article has discussed the XCZU2EG-3SBVA484E's model number, main features, product classification, application scenarios, usage, feature parameters, types of integrated circuits, complex manufacturing process, and packaging and testing. We hope this article has been helpful in understanding the technology behind the XCZU2EG-3SBVA484E.

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