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AMD
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XA3SD1800A-4FGG676I

Stock Available Pri Referans (Nan dola ameriken)
40+
$193.54
Manifakti Nimewo Pati:
XA3SD1800A-4FGG676I
Manifakti / Brand
AMD
Pati nan Deskripsyon:
IC FPGA 519 I/O 676FBGA
Datasheets:
XA3SD1800A-4FGG676I(1).pdfXA3SD1800A-4FGG676I(2).pdf
Plon gratis Status / RoHS Status:
Stock kondisyon:
Nouvo orijinal, Stock Disponib.
Bato de:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Enquiry sou entènèt

Tanpri ranpli tout jaden obligatwa yo ak enfòmasyon kontak ou.Klike sou "DEMANDE YO"Nou pral kontakte ou yon ti tan nan imèl. Oswa voye yon imèl nou: info@ic-xilinx.com
Nimewo Pati
Manifakti
Mande Kantite
Pri Sib(USD)
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Kontakte Non
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Tanpri antre kòd Verify la epi klike sou "Soumèt"
Nimewo Pati XA3SD1800A-4FGG676I
Manifakti / Brand AMD
Kategori Sikit entegre Integrated (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Deskripsyon IC FPGA 519 I/O 676FBGA
Plon gratis Status / RoHS Status: RoHS Compliant
Voltage - Pwovizyon pou 1.14V ~ 1.26V
Total Bits RAM 1548288
Founisè Aparèy pake 676-FBGA (27x27)
Seri Automotive, AEC-Q100, Spartan®-3A DSP XA
Pake / Ka 676-BGA
Pakèt Tray
Operating Tanperati -40°C ~ 100°C (TJ)
Kantite Eleman Lojik / Selil 37440
Kantite LAB / CLBs 4160
Kantite I / O 519
Nimewo nan Gates 1800000
Mounting Kalite Surface Mount
Nimewo pwodwi baz XA3SD1800

Anbalaj

Nou ofri bon jan kalite ki pi wo a, ki pi ekonomikman pri anbalaj pwoteksyon estatik ki disponib. Avèk 40% transparans limyè, itallows pou idantifikasyon fasil nan IC a (sikwi entegre) ak PCB a (printscircuit ankadreman). Tretman ki pi dirab ki gen antye metal yo bay pèfòmans FaradayCage ki nesesè pou yo byen pwoteje eleman sa yo kont chaj otomatik yo.

Tout pwodwi yo pral procesna nan anti-staticbag. Bato ak pwoteksyon antistatik ESD.
Eksepte pake ESD anbalaj a pral sèvi ak enfòmasyon konpayi nou an: Pati mòmon, mak ak Kantite.
Nou pral enspekte tout byen yo anvan chajman, asire tout pwodwi yo nan bon kondisyon epi asire ke pati yo se nouvo orijinalmatch fichye.
Apre tout machandiz yo asire pa gen okenn pwoblèm afterpacking, nou pral procesna san danje epi voye pa eksprime mondyal. Li exhibitsexcellent bon rezistans ak dlo ansanm ak entegrite bon sele.
Nou ka ofri sèvis livrezon atravè lemond eksprime, tankou DHLor FedEx oswa TNT oswa UPS oswa lòt komisè pou chajman.

Global Shipment pa DHL / FedEx / TNT / UPS

Frè anbak referans DHL / FedEx
1). Ou ka ofri eksprime kont livrezon ou pou chajman, si ou pa gen okenn kont eksprime pou chajman, nou ka ofri inadvance kont nou an.
2). Sèvi ak kont nou pou chajman, chaj chajman (Referans DHL / FedEx, diferan peyi gen pri diferan.)
Chaj chajman: (Referans DHL ak FedEx)
Pwa (KG): 0.00kg-1.00kg Pri (USD $): USD $ 60.00
Pwa (KG): 1.00kg-2.00kg Pri (USD $): USD $ 80.00
* Pri a nan pri a se referans ak DHL / FedEx. Chaj detay yo, tanpri kontakte nou. Diferan peyi chaj eksprime yo diferan.



XA3SD1800A-4FGG676I Pwodwi Detay yo:

Unlocking the Power of the XA3SD1800A-4FGG676I Integrated Circuits: A Comprehensive Guide When it comes to high-performance, customizable electronics, few tools are as versatile as Field Programmable Gate Arrays (FPGAs). Among the best-in-class FPGAs available is the XA3SD1800A-4FGG676I Integrated Circuit (IC), which offers unparalleled flexibility and computing power. In this article, we'll dig deep into the features and functions of the XA3SD1800A-4FGG676I IC, as well as discussing the role of FPGA technology in modern electronics. At its core, the XA3SD1800A-4FGG676I is a cutting-edge FPGA with a maximum capacity of 1,800,000 system gates. This chip supports up to 519 I/O pins, making it ideal for a wide range of applications, from automotive to aerospace, consumer electronics to industrial automation. While the XA3SD1800A-4FGG676I is a formidable component, it's important to note that it is an Embedded FPGA, which means it is designed to work with other chips and systems to deliver best-in-class performance. Whether you're building a custom application or integrating with a pre-existing system, the XA3SD1800A-4FGG676I is ready to deliver outstanding results. One of the most impressive features of the XA3SD1800A-4FGG676I is its output performance, with voltage ranges of 0.9V to 1.2V and current ranges of -6mA to 24mA. Additionally, the chip offers a temperature range of -40°C to +100°C and boasts power efficiencies of up to 0.15W/MHz. These performance parameters make the XA3SD1800A-4FGG676I a top-choice for many industries. In terms of its application scenarios, the XA3SD1800A-4FGG676I is incredibly versatile. It can be used in a wide variety of electronic devices, ranging from handhelds to enterprise-grade systems. Automotive and aerospace systems benefit greatly from the chip's extreme environment resistance and automotive qualification. And for high-speed network equipment, the XA3SD1800A-4FGG676I can be used for switching, routing and serialization/deserialization (SERDES). The manufacturing process of the XA3SD1800A-4FGG676I is a complex and precise, including the chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. Finished products have to undergo strict packaging and testing processes to ensure their quality and stability. That's why the XA3SD1800A-4FGG676I is a reliable and trusted component in many industries worldwide. In conclusion, the XA3SD1800A-4FGG676I is a vital component in high-performance electronics. It's an incredibly versatile chip that can be used in a wide range of applications, and its performance parameters are second-to-none. Whether you're an engineer or a hobbyist, consider leveraging the power of the XA3SD1800A-4FGG676I for your next project.

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