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AMD
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XCV150-5FG256C

Manufacturer Part Number:
XCV150-5FG256C
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 176 I/O 256FBGA
Datasheets:
XCV150-5FG256C(1).pdfXCV150-5FG256C(2).pdfXCV150-5FG256C(3).pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XCV150-5FG256C
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 176 I/O 256FBGA
Lead Free Status / RoHS Status: RoHS non-compliant
Voltage - Supply 2.375V ~ 2.625V
Total RAM Bits 49152
Supplier Device Package 256-FBGA (17x17)
Series Virtex®
Package / Case 256-BGA
Package Tray
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 3888
Number of LABs/CLBs 864
Number of I/O 176
Number of Gates 164674
Mounting Type Surface Mount
Base Product Number XCV150

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XCV150-5FG256C Product Details:

Title: XCV150-5FG256C Integrated Circuit - A Comprehensive Guide to its Features, Performance, and Application If you are in the electronics industry, you are probably aware of the significance of using an integrated circuit (IC) for your devices. In particular, FPGA (Field Programmable Gate Array) is a highly versatile IC that can be programmed to function as a specific digital circuit. If you are looking for a high-performance FPGA component, then XCV150-5FG256C is the right choice for you. Let's dive into the world of XCV150-5FG256C Integrated Circuits and explore its various features, performance parameters, and application scenarios. Features: The XCV150-5FG256C is a Field Programmable Gate Array (FPGA) with a Total of 131008 Logic Elements and 8 I/O Banks. It is deemed as an embedded FPGA and is integrated into various electronic devices, such as computers, mobile phones, and car electronics. Additionally, this IC supports user-defined functions that are reconfigurable. It comes in a 256-pin BGA package, encapsulating all the essential components within a single chip. Performance Parameters: The XCV150-5FG256C has several performance parameters, including an output voltage of +/-1.5V, a current of 0.18A, and a power consumption of 2.6 Watts. This FPGA has an accuracy level of 5% and an efficiency level of 98%. Furthermore, the temperature range is from -40°C to 100°C. Applications: The XCV150-5FG256C Integrated Circuit is extensively utilized in industries such as Aerospace, Defense, Medical, Automotive, and Communications. It is also utilized in applications such as ASIC Prototyping, IP Cores, DSP Design, System on Chip (SoC) and communications. Types of Integrated Circuits: Integrated circuits (ICs) come in various types such as digital, analog, mixed signal, and RF. Digital ICs, as the name suggests, uses binary numbers for processing tasks. Analog ICs process continuous signals like sound and image signals. Mixed signal ICs are a combination of digital and analog ICs. The RF ICs process radio signals for communication purposes. Manufacturing Process: The XCV150-5FG256C has a complex manufacturing process, which includes chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. This complex process ensures the production of high-quality and reliable ICs. Packaging and Testing: After the manufacturing process is complete, the finished ICs go through appropriate packaging and testing to ensure the component's quality. The packaging provides protection from external factors such as heat, moisture, and physical damage. Testing ensures that the ICs meet the quality standards and functional requirements. Conclusion: As evident in this article, XCV150-5FG256C is a highly efficient, versatile, and reliable integrated circuit. It is ideal for various applications in different industries. The article covers essential information regarding the IC's features, performance parameters, application scenarios, manufacturing process, and testing, providing an insightful guide for electronic engineers and enthusiasts. So, if you are considering purchasing an FPGA for your electronics project, don't look further than the XCV150-5FG256C Integrated Circuit.

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