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AMD
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XC7V585T-1FF1761I

Stock Available Reference Price(In US Dollars)
1+
$7,812.39
Manufacturer Part Number:
XC7V585T-1FF1761I
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 850 I/O 1761FCBGA
Datasheets:
XC7V585T-1FF1761I(1).pdfXC7V585T-1FF1761I(2).pdfXC7V585T-1FF1761I(3).pdfXC7V585T-1FF1761I(4).pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

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Part Number XC7V585T-1FF1761I
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 850 I/O 1761FCBGA
Lead Free Status / RoHS Status: RoHS non-compliant
Voltage - Supply 0.97V ~ 1.03V
Total RAM Bits 29306880
Supplier Device Package 1761-FCBGA (42.5x42.5)
Series Virtex®-7 T
Package / Case 1760-BBGA, FCBGA
Package Tray
Operating Temperature -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells 582720
Number of LABs/CLBs 45525
Number of I/O 850
Mounting Type Surface Mount
Base Product Number XC7V585

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC7V585T-1FF1761I Product Details:

Title: "XC7V585T-1FF1761I Integrated Circuit (IC): Main Features, Application Scenarios, and Performance Parameters." Integrated circuits (ICs) are at the core of almost all electronic devices, and the XC7V585T-1FF1761I is no exception. This FPGA from Xilinx belongs to the Embedded IC family, which makes it an excellent choice for various applications. Let's dive into the product's main features, performance parameters, and applications. Main Features: The XC7V585T-1FF1761I is a high-end FPGA that enables designers to implement complex digital systems quickly. The main features of this FPGA include: 1. 1,020K logic cells 2. 50Mbits of internal memory 3. Configurable power management system 4. DSP slices, transceivers, and high-speed I/Os 5. Integrated Ethernet MACs controllers 6. PCI-Express Gen3 hard IP blocks Performance Parameters: The XC7V585T-1FF1761I has a maximum operating frequency of 825 MHz and can deliver up to 1.4 Teraflops of DSP performance. It also boasts a maximum power consumption of 46 W and can operate within a temperature range of -40°C to 100°C. With a 7.4 Gbps transceiver data rate, it provides high-speed data transfer, making it ideal for applications that require high-performance FPGA chips. Application Scenarios: The XC7V585T-1FF1761I is suitable for a wide range of applications, including wireless communications, medical imaging, and video processing, among others. This FPGA is also an excellent solution for high-speed networking, data-processing applications, and high-performance computing. Additionally, it can be used in electronic products like smartphones, tablets, and personal computers. Types of Integrated Circuits: Integrated circuits are classified based on their applications and functionality. Some of the common types of integrated circuits include digital, analog, mixed-signal, and RF ICs. Digital ICs process binary data, while analog ICs process analog signals. Mixed-signal ICs combine both analog and digital circuits, while RF ICs are designed for radio frequency applications. Manufacturing Process: The manufacturing process of integrated circuits is complex and requires several stages. The process includes chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, and etching, among others. Packaging and Testing: After the manufacturing process, the finished products need to undergo appropriate packaging and testing to ensure component quality. Proper packaging ensures that the IC is well-protected and can function correctly within the application. Testing of the IC is also essential to detect any faults that may have been introduced in the manufacturing process. Conclusion: The Xilinx XC7V585T-1FF1761I FPGA is a high-performance IC that can be used in various applications. Understanding the product's main features, performance parameters, application scenarios, and the IC manufacturing process is essential in selecting this product. Additionally, different types of ICs like digital, analog, mixed-signal, and RF ICs offer unique interfaces, which make them ideal for specific applications. Finally, proper testing and packaging ensure that finished products meet the required standards.

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