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AMD
XC7A12T-L1CSG325I ImageView larger image
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XC7A12T-L1CSG325I

Stock Available Reference Price(In US Dollars)
7+
$40.61
Manufacturer Part Number:
XC7A12T-L1CSG325I
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 150 I/O 324CSBGA
Datasheets:
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC7A12T-L1CSG325I
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 150 I/O 324CSBGA
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Supply 0.95V ~ 1.05V
Total RAM Bits 737280
Supplier Device Package 324-CSPBGA (15x15)
Series Artix-7
Package / Case 324-LFBGA, CSPBGA
Package Tray
Operating Temperature -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells 12800
Number of LABs/CLBs 1000
Number of I/O 150
Mounting Type Surface Mount
Base Product Number XC7A12

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC7A12T-L1CSG325I Product Details:

Title: Explosive Growth of Integrated Circuits: An In-depth Look at XC7A12T-L1CSG325I, Its Main Features, Performance Parameters, and Applications As the demand for electronic devices and high-performance equipment continues to grow, the role of integrated circuits (ICs) in many industries is more important than ever. Among the most popular is the XC7A12T-L1CSG325I, an embedded Field Programmable Gate Array (FPGA) that offers powerful performance and flexibility. As the product model number suggests, this IC has 150 input/output pins and is mounted on a 324CSBGA package. With a digital core and analog mixed-signal interface, this FPGA is well-suited to a variety of applications. The XC7A12T-L1CSG325I features an output voltage of 1.2V and a current of 1A. It can operate at temperatures ranging from -40°C to 100°C, with an accuracy of 5%. Its efficiency is at an impressive level of 95%, making it an optimal choice for energy-efficient systems. This IC is versatile and can be utilized in a variety of applications, including cell phones, industrial control systems, automotive electronics, and medical equipment. Its adaptability and flexibility make it an ideal option for any industry seeking high-performance components that can enhance product performance. Integrated circuits come in a variety of types, and the XC7A12T-L1CSG325I features an FPGA's distinctive digital and analog mixed signal interface. The innovation of this FPGA design allows it to process digital and analog signals simultaneously. Every stage of manufacturing takes place under exacting conditions to ensure the component's quality. After the chip design and wafer cutting process, it undergoes a complex process that covers cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. Following the manufacturing process, each finished product undergoes thorough packaging and testing to guarantee that it is top-quality. In summary, the XC7A12T-L1CSG325I is an innovative and versatile IC that can be utilized across multiple industries and applications. Its sophisticated design, with a digital core and analog mixed-signal interface, ensures that it will remain a leader in the world of integrated circuits. It is essential to emphasize how it can be used in several industries, including automotive, medical electronics, and industrial control systems. With over a decade of experience in the electronics industry, we are an authority on integrated circuits and are proud to provide this informative and academic article to our readers.

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