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AMD
XC6VSX315T-2FF1156C ImageView larger image
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XC6VSX315T-2FF1156C

Stock Available Reference Price(In US Dollars)
1+
$5,299.98
Manufacturer Part Number:
XC6VSX315T-2FF1156C
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 600 I/O 1156FCBGA
Datasheets:
XC6VSX315T-2FF1156C(1).pdfXC6VSX315T-2FF1156C(2).pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC6VSX315T-2FF1156C
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 600 I/O 1156FCBGA
Lead Free Status / RoHS Status: RoHS non-compliant
Voltage - Supply 0.95V ~ 1.05V
Total RAM Bits 25952256
Supplier Device Package 1156-FCBGA (35x35)
Series Virtex®-6 SXT
Package / Case 1156-BBGA, FCBGA
Package Tray
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 314880
Number of LABs/CLBs 24600
Number of I/O 600
Mounting Type Surface Mount
Base Product Number XC6VSX315

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC6VSX315T-2FF1156C Product Details:

Title: XC6VSX315T-2FF1156C Integrated Circuit (IC): Main Features, Application Scenarios, and Manufacturing Process In the world of digital electronics, Integrated Circuits (ICs) are the backbone of modern-day gadgets and electronic devices. The XC6VSX315T-2FF1156C is an FPGA (Field Programmable Gate Array) IC that is highly versatile and efficient in its performance. Here's an in-depth guide on the product model number, main features, classifications, application scenarios, usage, feature parameters, and manufacturing process of XC6VSX315T-2FF1156C IC. Main Features and Performance Parameters XC6VSX315T-2FF1156C IC has a high output voltage rating and an input current of about 600 I/O pins. The product is highly accurate with unique features such as temperature range, efficiency, and power, making it ideal for a wide range of applications. Application Scenarios and Usage XC6VSX315T-2FF1156C IC is suitable for different electronic devices, industries, and specific applications. The product is used in applications like aerospace and defense systems, high-performance computing, wired/wireless telecommunications, and multiple industrial applications. Different Types of ICs: Digital, Analog, Mixed Signal, and RF There are different types of ICs available in the market, each with unique features and applications. The digital ICs deal with digital signals, analog ICs work with continuous signals, mixed signal ICs combine features of digital and analog ICs, while RF ICs use radio frequency signals for communication. Manufacturing Process of ICs The XC6VSX315T-2FF1156C IC undergoes a complex manufacturing process, which includes chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. It is essential to mention that finished products need to undergo appropriate packaging and testing to ensure component quality. In conclusion, the XC6VSX315T-2FF1156C is a versatile and high-performance IC that is ideal for different electronic devices, industries, and specific applications. With its unique features, high accuracy, and efficient performance, it is a valuable addition to any application and electronic gadget.

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