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AMD
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XC2VP40-5FF1152C

Manufacturer Part Number:
XC2VP40-5FF1152C
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 692 I/O 1152FCBGA
Datasheets:
XC2VP40-5FF1152C(1).pdfXC2VP40-5FF1152C(2).pdfXC2VP40-5FF1152C(3).pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC2VP40-5FF1152C
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 692 I/O 1152FCBGA
Lead Free Status / RoHS Status: RoHS non-compliant
Voltage - Supply 1.425V ~ 1.575V
Total RAM Bits 3538944
Supplier Device Package 1152-FCBGA (35x35)
Series Virtex®-II Pro
Package / Case 1152-BBGA, FCBGA
Package Bulk
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 43632
Number of LABs/CLBs 4848
Number of I/O 692
Mounting Type Surface Mount

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC2VP40-5FF1152C Product Details:

XC2VP40-5FF1152C: A Comprehensive Guide to Integrated Circuits (ICs) for Embedded Systems If you're looking to incorporate dynamic solutions into your electronic devices, XC2VP40-5FF1152C ICs are a perfect fit. They belong to the embedded FPGAs (Field Programmable Gate Array) classification and offer a plethora of features that make them suitable for a wide range of applications. Main Features and Performance Parameters XC2VP40-5FF1152C, featuring a 692 I/O 1152FCBGA, delivers robust performance parameters, output voltage, current, power, accuracy, efficiency, and temperature range. The IC provides a comprehensive range of parameters that make it suitable for a broad spectrum of industrial and commercial use cases. Application Scenarios and Usage XC2VP40-5FF1152C ICs are versatile and can be used in various electronic devices and industries. They are a popular choice for high-performance computing, aerospace, and defense systems, and medical instrumentation. Other applications include video and image processing, networking, telecommunications, and transportation. The Different Types of Integrated Circuits There are different types of ICs, including digital, analog, mixed signal, and radiofrequency (RF). Digital ICs are used in electronic devices to store, process, and convey digital signals. Analog ICs handle signals that vary in voltage or current amplitude, while mixed-signal combines both analog and digital. RF ICs, on the other hand, incorporate radiofrequency capabilities into electrical circuits. Manufacturing Process The advanced manufacturing process for XC2VP40-5FF1152C ICs includes a variety of steps. It starts by designing the chip and ends in cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. The complex process ensures that the IC meets the high-quality standards required to function correctly. Packaging and Testing XC2VP40-5FF1152C ICs undergo appropriate packaging and testing to ensure the components' quality. The chips are packaged in sophisticated materials that protect the ICs from external factors such as temperature, pressure, and humidity. Testing is done to ensure the ICs meet the required specifications before they are shipped to customers. In summary, XC2VP40-5FF1152C ICs are a perfect choice for individuals and organizations looking to incorporate dynamic solutions into their electronic devices' design. With its features and performance parameters, versatile applications, and rigorous manufacturing process, it is an excellent option for various industries and use cases.

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