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AMD
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XC2VP4-5FG256C

Manufacturer Part Number:
XC2VP4-5FG256C
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 140 I/O 256FBGA
Datasheets:
XC2VP4-5FG256C(1).pdfXC2VP4-5FG256C(2).pdfXC2VP4-5FG256C(3).pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC2VP4-5FG256C
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 140 I/O 256FBGA
Lead Free Status / RoHS Status: RoHS non-compliant
Voltage - Supply 1.425V ~ 1.575V
Total RAM Bits 516096
Supplier Device Package 256-FBGA (17x17)
Series Virtex®-II Pro
Package / Case 256-BGA
Package Bulk
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 6768
Number of LABs/CLBs 752
Number of I/O 140
Mounting Type Surface Mount

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC2VP4-5FG256C Product Details:

XC2VP4-5FG256C: High-Performance FPGA for Embedded Applications Integrated Circuits (ICs) are at the forefront of powerring modern electronic devices. The XC2VP4-5FG256C is a highly advanced and versatile Field Programmable Gate Array (FPGA). The product model number XC2VP4-5FG256C belongs to the Embedded-FPGA category that provides flexibility, reliability, and cost-effectiveness. Main Features: The XC2VP4-5FG256C delivers outstanding performance metrics such as output voltage, current, power, accuracy, and efficiency. It has a temperature range of -40°C to 100°C, making it suitable for various electronic devices and industrial applications. Application Scenarios: The XC2VP4-5FG256C finds its usage in Communication and Networking, Aerospace, Defense, and Automotive sectors. It provides flexibility in hardware acceleration, digital signal processing, and high-speed connectivity with leading-edge technology. Usage and Feature Parameters: The product supports more than 140 input/output interfaces, including high-speed differential pairs, memory interface, and configuration interface. It provides up to a million logic cells, high-speed transceivers, and clocking resources, making it an excellent addition for system-on-chip (SoC) designs. Types of Integrated Circuits: The XC2VP4-5FG256C belongs to the digital IC family and provides Programmable Logic Functions. Different types of integrated circuits, such as digital, analog, mixed-signal, and RF, are used in various electronic devices and industries depending on their function. Manufacturing Process: The manufacturing of the XC2VP4-5FG256C involves a multi-step process starting from chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. This complex manufacturing process ensures the reliable and efficient performance of the IC. Packaging and Testing: Finished products need to undergo appropriate packaging and testing to ensure component quality. The XC2VP4-5FG256C undergoes rigorous testing to guarantee its reliability and performance under extreme conditions. In conclusion, the XC2VP4-5FG256C is a highly advanced and versatile FPGA that provides flexibility, reliability, and cost-effectiveness. Its exceptional performance metrics, industry applications, and complex manufacturing process make it an ideal solution for modern electronic devices.

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