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AMD
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XC17256ELPD8I

Manufacturer Part Number:
XC17256ELPD8I
Manufacturer / Brand
AMD
Part of Description:
IC PROM SER I-TEMP 256K 8-DIP
Datasheets:
XC17256ELPD8I(1).pdfXC17256ELPD8I(2).pdfXC17256ELPD8I(3).pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC17256ELPD8I
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Memory - Configuration Proms for FPGAs
Description IC PROM SER I-TEMP 256K 8-DIP
Lead Free Status / RoHS Status: RoHS non-compliant
Voltage - Supply 3V ~ 3.6V
Supplier Device Package 8-PDIP
Series -
Programmable Type OTP
Package / Case 8-DIP (0.300", 7.62mm)
Package Tube
Operating Temperature -40°C ~ 85°C
Mounting Type Through Hole
Memory Size 256Kb
Base Product Number XC17256EL

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC17256ELPD8I Product Details:

XC17256ELPD8I: A Comprehensive Guide to Integrated Circuits Integrated circuits have revolutionized the electronics industry, and the XC17256ELPD8I is no exception. This top-of-the-range component is a configuration PROM suitable for use with FPGAs, offering superior performance in a range of electronic devices and industrial applications. In this article, we'll delve into the key features and performance parameters of the XC17256ELPD8I, exploring its application scenarios, usage, and complex manufacturing process. We'll highlight the different types of integrated circuits, from digital to RF, and show how this product outstrips the competition in terms of reliability, accuracy, and efficiency. Key Features and Performance Parameters At the core of the XC17256ELPD8I is a memory of 256K, delivering high-quality output voltage, current, and power. This ensures accuracy and efficiency, with a temperature range suitable for a wide range of industries and applications. With its superior performance parameters, this product is well suited to use with FPGAs and other high-end components. Application Scenarios and Usage The XC17256ELPD8I is ideal for use in a range of electronic devices, including embedded systems, automotive instruments, and consumer appliances. It's also well-suited to industrial applications, such as automation, manufacturing, and control systems. With its suitability for both low and high-temperature operations, its versatility is unparalleled. Types of Integrated Circuits The XC17256ELPD8I is a digital configuration PROM, one of the many types of integrated circuits on the market. Other types include mixed-signal circuits, RF circuits, and analog circuits. Each type is designed for specific purposes and applications, delivering unique features and performance characteristics. Complex Manufacturing Process The manufacturing process of the XC17256ELPD8I is complex, requiring expertise and sophisticated equipment. The process includes chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. High-quality components are essential for the reliable operation of electronic devices, and the XC17256ELPD8I delivers just that. Packaging and Testing The finished product must undergo appropriate packaging and testing procedures to ensure that components meet high-quality standards. This process includes visual inspection, functional testing, and surface mount technology (SMT) assembly. The XC17256ELPD8I undergoes rigorous testing to ensure its superior performance and reliability, making it an ideal choice for even the most demanding applications. In conclusion, the XC17256ELPD8I is a top-tier integrated circuit developed for FPGAs and other high-end components. With outstanding features, unmatched performance, reliability, versatility, and a complex manufacturing process, it is a reliable component for use in a wide range of industries and applications. Opt for the XC17256ELPD8I to experience the best performance and quality for your electronic needs.

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